Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning MachinesPangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning MachinesPangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning MachinesPangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning MachinesPangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines
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$7977.96~19944.9
Other Devices · Basic Manufacturing Equipment · Machine Tools

Pangda Specializes in The Production of Wafer Grinding Machines Silicon Wafer Thinning Machines

Released on2024年04月29 04:36
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Shenzhen Ponda Grinding Technology Co.,Ltd.
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Model NO.:FD-300QA Automatic Grade:Semiautomatic Cylindrical Grinder Type:Surface Grinding Machine Precision:High Precision Certification:ISO 9001 Condition:New Power Source:Electricity Disc(Wheel) Type:Grinding Disc Variable Speed:with Variable Speed Application:Semiconductor Material Material:Metal and Non-Metal Working Style:Reduction Disc Diameter:Φ300 Service:Oversea Setup & After-Sale Avalaible Class:Single Plate Process Station:3 Pressure Source:Pneumatic or Weight Block Plate Material:Metal & Non-Metal Abrasive:Slurry Weight:1000kg Transport Package:Wood Crate Trademark:PONDA Origin:China Production Capacity:500 Unit/Year
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